Single interface/dual interface ®÷ ≈smart card and its manufacturing proce"<‍ss

 technical field

[0001] The present invention belongs toΩ & the field of record carriers wi ☆λ↑th integrated circuit (∞λ™IC) chips. Specifically, ©σ☆∞the present invention relates to a←✔₹ manufacturing proce ±®ss for a single interface/dual i←§‍¥nterface smart card and a δ₩<€single interface/dual interface smar♦₩t card manufactured from it.

 Technical background

[0002] Smart cards with integrεσated circuit chips have been ↑™  widely used in daily life for banking α£≥≥and small payments, telephone commun↑Ω☆×ication, public transp≥≥ortation systems, and publi∑✘♦×c services. Although non-conta★♣φct card reading methods such as wirel₽<ess communication and near field cβπommunication (NFC) have become r♣‌esearch hotspots, they are wid×♣ely present in the co"&α‌ntact card reading facilities of exis×" ting banks, communicatio‍ ×n and public service institutio♥δ φns, and account for the ±​vast majority of them. The cost of upd₽≠ating them all is hu≥≠±→ge, and non-contact card reading and§∞$" writing methods do not conform☆≠‌ to the habits of some con≤γsumers.

[0003] Therefore, a sinγ →λgle interface/dual interface sm₩↓☆art card includes two to seven protecti≤↕ve layers mainly com→←→∞posed of PVC material, at le¶​∑ast one IC chip with a touc♥∞¶★hable surface exposed on the surfac∞Ωe of the smart card, and an antenna♦" electrically connected to §↓§←the chip. Among them, IC chips cλ​≈an read and write information®‍γ  through contact points, or acc"±→≠ess through antenna induction at a c< λertain distance. The former can follow ‍↓→≥the technical standards ‍λ<↓of contact IC cards such as ISO/IEC 78•α"α16, while the latter can follow the tec♠π→hnical standards of non♠↑-contact IC cards such as ISO/IEC 1‌¶4443, but both share tφ±♠he same microprocessor, operating systeφ£✘₽m, and memory.

[0004] Currently, there are €™÷literature reports on singleλπ>∑ interface/dual interface smart card 's and their manufacturing pr★×↑♦ocesses. The traditional process ©≥  involves burying wires, milling gΩ→rooves, and then soldering them to ¥•↓the chip after wire picking, which is¶€×≤ slow in speed (where wire φ♦picking and/or subsequent☆₩¶÷ steps need to be manually c÷π→'ompleted), and the a '∏♠ntenna is prone to milling a$σ"±nd cutting. Therefore, it has bγ® ≠een abandoned by current ₽®​≤research, especially in recent studα¶$δies where wire picking steps are avoi>λεded as much as possible.₹☆ For example, Chinese patent<↔× 200910105480 sequentially uses cσ‍βorrection position, collis♦≤λion welding, in correction positi↕↕‍εon, spot welding, and la≈∑mination to produce single/double inte₹ε©≤rface cards. However, the inventor'∞✔•₩s research found that such frΩ‌♥±equent correction position o•✘Ω​perations are difficul≥±©¶t and prone to virtual ≤©≤soldering, or excessive or displaced so"•lder that can damage thδ×↓e chip, resulting in a low yield÷Ω rate.

[0005] For example, Chinese patent 2010πσ≤₩10542938 discloses a™↓ ♦n intelligent single interface/₹↕ε✔dual interface card, which Ω improves the traditional process of wi ↓re picking and welding by re ↓Ωquiring at least two laminat∏®₹₹ion steps to leave space for acα÷commodating conductive ₽♠ εwelding materials du♣φring the process and fill it∑♥, then milling out a slot that can ∑∑✔♥accommodate the chip, and then ≠λφinserting the chip for wel→♦$•ding. However, the inventor's resσ↕ earch has found that the weldi>✔ng difficulty is very high b​σ×ecause the space for acco←€mmodating the welding head is <§γ✔extremely small or non-existent→®★, and the high temperature of the ca"↓↓libration space can easily damγ‌∑age the chip. In order to ≥♦prevent heat dissipation, the e¥↓nvironmental temperature r £‍equirements are high, and som¶γ★etimes workers near the production linβ★e breathing violently m"♦ay cause virtual welding.

[0006] In addition, Chinese pate★φnt 201010580948 discloses aε  single interface/dual interfa§•↓ce smart card, which is ​∑β×prepared by specifical¶≈πly milling a space on the card¶φ±© base that can accommodate ∑★γ≈conductive materials, and loπ>≤‌ading conductive materials such as spri∏γ‌★ngs, but still requires processes suc←±←h as collision welding, position corr×↓®‍ection, and thermal welding.

[0007] In addition, a sδש imple contact type smart card do÷€φΩes not have an antenna, so there is no→‌  need to consider electrical connectσ≈ion between the antenna λ≠♥€and the IC chip; Simple non-conta‌φct smart cards, such as RF ✔∏ID tag cards, usually have the∏₹™ IC chip and antenna completel∞πδy encapsulated inside the prot​₽ective layer, so the ele✘÷®★ctrical connection method is simple and♥™✔☆ requires low requirements (due≈≈ to the easy displacement of∞<εα the chip during use, th↕♣π₽e electrical connection between the antק±εenna and the chip in×♣ single interface/dual→∑≤× interface smart cards is much♥​ stronger). It can b$σe completed through simple solde↓∞ring, and then encapsulated intε§o the protective layer♥ ↕ (see Chinese patents 200410027952λ§≈, 200710030900, 2008←∏₽10213009, 201110048619,π€ etc.).

[0008] After long-term research and pra£↕₽ctice, it has been found that th ®≈e traditional process of sin•♣Ωgle interface/dual in​εεterface smart cards is not without®∞ flaws. Its slow speed ma "π÷kes it difficult for the wiα‍•∞re picking step to be aφ>ccurately clamped by the↔↑ fixture and achieves‌↓β automation. Although the d☆>∑isadvantage of the antenna being ea±σ₽∏sily milled off needs to be ₹↓§overcome, it can be used as a vi✘ε$✔sual inspection indicator β∞₩of milling groove quality; In ÷→≥addition to the aforementioned ×✔±drawbacks, the recently developed n≈₹ew technology, even if✔ ↑ the soldering is firm, is subject <≈÷♣to tight constraints such as₩≠​≈ antennas and soldering po₩‍ints, as well as compression from IC chπ>φips. Frequent contact λβΩ∞with card readers or poor u ≤×sage habits (such as reλ÷peated bending and significan&↔™αt temperature changes during use) can →♠±§cause slight displacem§<ent of the chip and sλ↔eparation from the aε←ntenna, resulting in poor co≠ ntact. Based on these findings, after a‌  ☆rduous research by the inventor, a s€§☆§urprising manufacturing¶λ±₩ method for single/dual i>≈nterface smart cards has be‍®÷ en developed, which ove​™ rcomes the shortcomings of traditiπ↑onal processes, facilit•‌¶↕ates automated wire picking, and makes↓≤ the antenna less pro♦•ne to milling or bre ¶÷₽aking; Overcoming the shor©×∞λtcomings of recent research processes,λ☆±☆ the antenna has unconstrai ÷ned redundancy to cope✔π÷β with small chip displacements i₽• n daily use without poor±& contact, without the need for ₹€ cumbersome steps; It also retains thγ₹ε>e advantages of traditional p'™αφrocesses, such as the simple welding p∏ ‍rocess itself, easy operation, an∏€≈>d the ability to continue u↕→£sing or retaining traditional process ₹♦φ♦equipment with lower prices, res ≈>ulting in lower costs; What&★≥#39;s even more unexpecte£‌γd is that this method has higher fau‍✘±γlt tolerance for manufacturers affecte↕£πd by unstable batches™π  (or even the same batch) of domes&♠✘ tic plastic products and wires, and the→≤£± quality of milling steps can be visual★ ₹✘ly inspected. In addition, it ←≈can also prevent counterfeiting©‌ to a certain extent.

For detailed information, please feel♣&®© free to consult, communicδ£¥ate and request.